BGA Reballing Stencil for Apple iPhone 7 Plus

The BGA Reballing Stencil for Apple iPhone 7 Plus is a workshop template for reballing the BGA chips on the iPhone 7 Plus motherboard: it lets you re-deposit solder balls on a chip after it has been removed.

It is used in board-level repair to restore the BGA solder connections of a removed component, following the original ball layout.

Main features

• Type: BGA reballing stencil
• Compatible model: Apple iPhone 7 Plus (A1661, A1784, A1785, A1786)
• Condition: new
• Quality control: QC Passed

BGA Stencil for iPhone 7 Plus Motherboard

The template guides the placement of the balls on the chip pads. The iPhone 7 Plus stencil is a specific tool for anyone doing board-level repairs.

Workshop Tool for Micro-Soldering

Suitable for technicians and service centers specialized in micro-soldering. Discover all the details of this stencil

Compatibility

• Apple iPhone 7 Plus: A1661, A1784, A1785, A1786

Package contents

1 x BGA Reballing Stencil for Apple iPhone 7 Plus

Solder balls, paste and other tools not included.

Usage note

Use only with suitable micro-soldering equipment and procedures, and check the board model before starting. Clean the stencil after use to keep it accurate.

Certifications and warranty

Every item passes QC Passed quality control before shipping and is covered by the legal guarantee of conformity under Italian Legislative Decree 206/05 (Consumer Code). Warranty replacement is available for functional defects, provided the item has not been damaged by misuse, impacts or tampering. Images are for illustration purposes.

For detailed information on warranty, returns and purchase conditions, please see our Terms of sale.

Note: the trademarks mentioned belong to their respective owners and are used only to identify compatibility. There is no affiliation with Apple Inc.