BGA Reballing Stencil for Apple iPhone 8 / 8 Plus

The BGA Reballing Stencil for Apple iPhone 8 / 8 Plus is a reballing mask used to recreate the solder balls of the BGA components on the iPhone 8 and iPhone 8 Plus motherboards.

It is used in board-level repair, when a BGA chip has to be removed and refitted: the stencil guides the placement of the solder balls on the component pads before resoldering.

Main features

• Type: BGA reballing stencil
• Intended for: iPhone 8 / 8 Plus motherboard
• Use: professional electronics repair
• Condition: new
• Quality control: QC Passed

Stencil for iPhone 8 / 8 Plus Chip Reballing

The mask allows precise work on the solder balls of BGA components. The BGA reballing stencil is a bench accessory for anyone doing micro-soldering on Apple boards.

Workshop Tool for Micro-Soldering

Suitable for technicians and service centers specialized in motherboard repair, it is a useful accessory on the workbench. Discover all the details of this stencil

Compatibility

• Apple iPhone 8
• Apple iPhone 8 Plus

Package contents

1 x BGA Reballing Stencil for Apple iPhone 8 / 8 Plus

Usage note

Use the stencil with flux and solder suitable for reballing, and clean it after each use to keep the holes clear. Use by staff experienced in micro-soldering is recommended.

Certifications and warranty

Every item passes QC Passed quality control before shipping and is covered by the legal guarantee of conformity under Italian Legislative Decree 206/05 (Consumer Code). Warranty replacement is available for functional defects, provided the item has not been damaged by misuse, impacts or tampering. Images are for illustration purposes.

Official documentation

If you are unsure about your iPhone model, you can check the official Apple website.

For detailed information on warranty, returns and purchase conditions, please see our Terms of sale.

Note: the trademarks mentioned belong to their respective owners and are used only to identify compatibility. There is no affiliation with Apple Inc.