Gel Flux Paste for Hot Air Soldering, BGA, IC, SMD Stick 10g

Gel Flux Paste for Hot Air Soldering, BGA, IC, SMD Stick 10g is a professional high-viscosity gel flux designed for hot air soldering on BGA, integrated circuits and SMD components. The tube with a resealable cap makes it easy to use and store.

It is used when you want smoother, more compact solder joints during circuit board rework, with no residue and no electrical conductivity.

Main features

• Type: professional gel flux paste, 10 g stick
• Application: hot air soldering, BGA, IC and SMD
• High viscosity, non-corrosive, non-degradable
• Leaves no residue, no electrical conductivity, excellent insulation
• No Clean formula, tube with resealable cap
• Assembly: not required, ready to use
• Quality control: QC Passed

Gel flux for BGA, IC and SMD rework

The high-viscosity gel texture allows precise dosing: this flux paste helps achieve smoother, more compact solder joints.

Professional flux for hot air stations

An essential consumable for the repair bench. Discover all the details of this product

Use

Suitable for soldering and reworking BGA, integrated circuits and SMD components with a hot air station.

Package contents

1 x Gel Flux Paste for Hot Air Soldering, BGA, IC, SMD Stick 10g

Usage note

Apply a small amount of gel to the area to be soldered, close the cap after use and work in a well-ventilated space.

Certifications and warranty

Product subjected to QC Passed quality control. Sale subject to Italian Legislative Decree 206/05; in case of defect, warranty replacement follows the sales conditions. Images are representative of the product.

Official documentation

Sales Conditions