Soldering Station Infrared BGA9000A

Microprocessor control with digital display complete with time and temperature for maximum performance.

Innovative method of XY axis adjustment that simplifies the complex focusing/positioning steps of the BGA on the PCB.

Uses split vision technology.

Equipped with high-precision optimizer with reliable accuracy.

Precision soldering. Reduces PCB distortion due to heat. Lower probability of repair repetition.

Uses infrared heat wave technology instead of conventional hot air, effectively solving the main problem encountered when using the hot air gun, which is the movement of surrounding components during rework.

Designed for both lead-free and standard soldering.

Versatile PCB support with board capacity up to 280 X 430 mm.